VolumAI X3D
Project Overview
About
AI systems require growing amounts of computing power and electricity, and conventional processors arrange most active components across a flat chip surface and use substantial energy to move data. VolumAI X3D stacks multiple processing layers vertically, allowing calculations and information transfer across three dimensions. This increases computing density, shortens communication paths and enables intermediate data to be reused between layers. Building on demonstrated multilayer transistor and logic structures, the project is progressing towards a functional processor that could run AI models using less space and energy.
Team
Saravanan Yuvaraja
Saravanan Yuvaraja is an Assistant Professor and Doctoral Supervisor at the Eastern Institute of Technology, Ningbo, China, where he leads the Multidimensional Integration and Testing (MIT) Lab. He received his Ph.D. in Electrical and Computer Engineering from KAUST. His research focuses on monolithic 3D integration, oxide and hybrid electronics, logic-memory systems, ultrawide-bandgap semiconductors, and AI hardware. His work includes first-author Nature Electronics demonstrations of 10-stack In_O_ 3D transistors and six-stack hybrid complementary circuits. He develops vertically integrated, energy-efficient electronic systems for next-generation intelligent hardware.